Micron uses a highly structured part numbering system to identify memory components and modules. Because physical chips are often too small for full part numbers, Micron also utilizes a five-digit FBGA Code (also known as a D9 code) as an abbreviated identifier. Key Decoding Tools
FBGA Part Marking Decoder: The primary tool for translating 5-digit chip markings (e.g., "D9VPP") into full Micron Part Numbers (MPN).
Serial Presence-Detect (SPD) Lookup: Allows users to find technical specs by entering a DRAM module part number.
Cross-Reference Tools: Useful for finding compatible replacements for DRAM and LPDRAM components. DRAM Component Decoding (Structure)
A typical component part number (e.g., MT40A1G8SA-062E:E) follows this general template: Prefix MT Micron Technology. Product Family 40 Technology type (40=DDR4, 62=LPDDR5, 41=DDR3). Voltage A Operating voltage (A=1.2V, F=1.1V for LPDDR5). Configuration 1G8 Density and width (e.g., 1 Gig x 8). Package Code SA Physical package type and lead-free status. Speed Grade -062E Maximum clock frequency or data rate. Temp / Status IT Operating environment (IT=Industrial, AT=Automotive). Die Revision :E The design version of the silicon. DDR5 Module Part Numbering System - Micron Technology
Micron memory part numbers can feel like trying to solve a puzzle, but once you know the "key," it's actually quite simple. Micron uses a standardized naming convention where each character in the string represents a specific technical attribute of the component. The Basic Structure
A typical Micron part number (MPN) usually follows this flow:
[Brand] [Technology] [Voltage] [Density] [Configuration] [Package] [Speed] [Revision] How to Decode the Key Segments Brand Identifier : Usually starts with (Micron Technology). Technology Type : DDR4 SDRAM : DDR5 SDRAM : Graphics Memory (GDDR) : NAND Flash Operating Voltage : 1.35V (Low Voltage) : This indicates the total capacity (e.g., for 4 Gigabits,
for 16 Gigabits). Remember, this is often in bits, not bytes! Configuration : Tells you the data bus width (e.g., x4, x8, or x16 Speed Grade : Look for the suffix after the package code (e.g., for DDR4-3200). Pro Tools for Quick Decoding
If you have a physical chip and can't find the full part number, look for the 5-digit FBGA code (e.g., D9VRL). FBGA & Component Marking Decoder Micron’s official lookup tool to convert that 5-digit code into a full part number. Part Catalog : Once you have the full MPN, the Micron Part Catalog provides the specific datasheet for that revision. Why Does This Matter? System Compatibility
: Ensuring the voltage and speed match your motherboard’s specs. Procurement
: Finding exact replacements for EOL (End of Life) components. Performance Tuning
: Identifying the specific die revision (e.g., "B-die" vs "E-die") which is crucial for overclocking. Do you have a specific part number 5-digit FBGA code you need help breaking down right now?
Let us dissect the DRAM example: MT40A1G16RC-062E:B
1. Prefix – The Manufacturer Identifier
The initial “MT” is the universal prefix for Micron Technology. This distinguishes Micron parts from those of Samsung (K4…), SK Hynix (H5…), or other vendors.
2. Product Family and Voltage
The next characters define the DRAM generation and voltage. In “40A,” the “40” indicates DDR4 SDRAM. (For DDR3, this would be “41” or “8K”; for DDR5, newer prefixes like “60B” appear). The “A” denotes the specific version or design family, often linked to voltage—for example, “A” typically signifies 1.2V VDD/VDDQ for DDR4. This field is critical because mixing voltages can destroy components.
3. Density and Organization
“1G16” splits into two parts: density and width. “1G” means 1 gigabit (Gb) of total memory. However, DRAM chips are often organized as “1G x 16,” where “16” indicates the device width in bits (DQ pins). A “16” yields a 16-bit-wide interface. Other common widths: 4, 8, or 32. Multiplying density by width confirms total capacity: 1Gb × 16 = 16Gb per chip? Wait—caution: In Micron’s notation, “1G16” actually means a 16-bit-wide device with a total density of 16 gigabits (because 1G refers to the number of words, and 16 bits per word). More precisely, it is 1G words × 16 bits = 16 Gb. For a designer building a 64-bit DIMM, four such chips would be needed.
4. Package and Ball Configuration
“RC” is a package designator. “R” often stands for a 78-ball BGA (for x16 DDR4), while “C” may specify the ball map or lead-free status. Other letters indicate different ball counts or package types (e.g., “U” for 96-ball BGA). This field ensures physical compatibility with PCB footprints.
5. Speed Grade (The Performance Key)
“-062E” is where timing enthusiasts focus. The “062” indicates the minimum cycle time in nanoseconds (ns)—here, 0.62 ns, which corresponds to a data rate of 1600 MHz (DDR4-3200). For older parts, “-125” meant 1.25 ns = DDR-800. The trailing “E” specifies the CL (CAS latency) and timing table, e.g., CL22 for DDR4-3200. Speed grade mismatches can cause system instability or failure to boot.
6. Revision and Special Flags
The colon and “B” denote the die revision. This is crucial for tracking errata, power changes, or timing improvements. Revision letters are sequential (A, B, C…). Sometimes an “IT” appears before the revision, signifying Industrial Temperature range (-40°C to +95°C) instead of Commercial (0°C to +95°C). An “A” at the end might indicate automotive grade.
| Part Number | Capacity | Type | Speed | Form Factor | |-------------|----------|------|-------|--------------| | MTA18ASF2G72AZ-3G2B1 | 16GB | DDR4 ECC UDIMM | 3200 | 288-pin DIMM | | MTA20ASF1G64HZ-2G6E1 | 8GB | DDR4 Non-ECC SODIMM | 2666 | 260-pin SODIMM | | MTA36ASF4G72PZ-3G2R1 | 32GB | DDR4 Registered ECC | 3200 | 288-pin RDIMM | | MTA18ASF4G72AZ-3G2B1 | 32GB | DDR4 ECC UDIMM | 3200 | 288-pin DIMM |
Micron simplifies the speed bin into a single digit immediately following the dash.
| Code | Speed (MT/s) | Common Name | | :--- | :--- | :--- | | -24 | 2400 | PC4-19200 | | -2E | 2666 | PC4-21300 | | -32 | 3200 | PC4-25600 | | -3E | 3200 (Extended) | PC4-25600E |
A Micron memory part number decoder translates the encoded information in Micron component IDs into human-readable attributes: product family, density, organization, speed, voltage, package, temperature range, revision, and manufacturing details. This examination explains how to read typical Micron DRAM and NAND part numbers, highlights common patterns and exceptions, and offers a practical decoding workflow with examples and useful tips.